Butyrospermun Parkii Butter

TL;DR. This ingredient is a rich emollient and occlusive lipid that softens skin, reduces transepidermal water loss, and adds cushion to creams, balms, body products, and hair conditioners. It also helps structure anhydrous formulas and contributes a thicker, creamier texture.

What does Butyrospermun Parkii Butter do in a cosmetic formula?

This ingredient is a rich emollient and occlusive lipid that softens skin, reduces transepidermal water loss, and adds cushion to creams, balms, body products, and hair conditioners. It also helps structure anhydrous formulas and contributes a thicker, creamier texture.

Is Butyrospermun Parkii Butter clean?

From a clean-beauty perspective, this ingredient is generally well-tolerated, low in irritation potential, and not a common restricted-list concern. Trace proteins are typically low after refining, although individual sensitivity is still possible with any botanical lipid.

Is Butyrospermun Parkii Butter sustainable?

This material is plant-derived, renewable, and readily biodegradable, with sourcing often tied to West African smallholder supply chains. Sustainability quality depends on fair sourcing, traceability, and refining practices rather than the molecule itself.

Is Butyrospermun Parkii Butter COSMOS-approved?

It is permitted under COSMOS-natural and can contribute to COSMOS-organic content when sourced and processed under the required certification conditions. It aligns well with Green Chemistry when mechanically extracted or simply refined, using renewable feedstock and biodegradable chemistry.

How does Butyrospermun Parkii Butter work chemically?

This compound is a triglyceride-rich plant lipid dominated by stearic and oleic acid chains, with a notable unsaponifiable fraction that includes sterols and triterpene esters. Typical use ranges are about 1 to 5% in emulsions and 5 to 30% in balms or body products, with a semi-solid melt profile near skin temperature and moderate oxidation sensitivity that improves with antioxidants and low-heat processing.

Last updated 2026-05-14